5-layer PMMA chip holds ±8 µm channel depth at series scale
Challenge. A point-of-care developer had a working prototype machined in-house, but channel depth drifted between lots and thermal bonding occasionally collapsed the shallower channels.
What we changed. We switched to stress-relieved cast PMMA, adjusted the bonding profile to a two-stage ramp with controlled pressure, and added in-process depth measurement on 100 % of wafers before bonding.
Result. Depth held to ±8 µm over a 75 × 25 mm footprint, burst pressure above 4 bar, and a first production lot shipped in 21 days.